As MWC 2015 draws closer and closer, just inching within weeks, let’s revisit some older topics and discussions. As we have heard, the Korean giant, Samsung, are planning to preview their latest handset, the long awaited Galaxy S6, and its unique variant, the S Edge. They will be announcing this device on March 1st in Barcelona, at Samsung’s Unpacked Event.
New case renders for the Galaxy S6 have just surfaced, and judging by the looks of the case, this suggest a “thinner” than expected build for the S6.
The camera positioning of the GS6 have already previously been leaked to have been oriented vertically on the right hand side, beside the camera. Multiple case manufacturers have already leaked their case designs.
Form factor has also been a big consideration of Samsung it seems, judging from recent dimension leaks. Rumors have it that the S6 will measure in at 6.9mm thick, a noticeable difference from the Galaxy S5. It almost seems like Samsung is trying to compete with Apple’s iPhone 6 Thickness form factor.
UPDATES ON THE HTC ONE M9
Just like Samsung, HTC will also be unveiling their overhyped handset, the HTC One M9 on March the 1st as announced by HTC themselves. New M9 leaks have surfaced, this time regarding the out of the box, pre-installed software/bloatware.
Reliable source, @upleaks recently posted a system dump on twitter supposedly revealing the names of the APK files that come pre-installed on the M9. We are not sure yet whether or not the OEM like LG will be offering consumers an option to remove, or De-Bloat your handset. Root users shouldn’t mind anyway.
A NEW COMPETITOR MAKES ITS APPEARANCE
The Asian company, BenQ, has just announced a smartphone device, which is unusual because when people think of BenQ, smartphones are definitely not on the top of their list. Anyway, the company has announced a new smartphone that should be making its way to MWC in March, and they are calling it, the BenQ F52. The handset packs top of the line specs, as seen in most 2015 Flagships, as we should be expecting to see it at the MWC release show.
The spec sheet for the F52 are as follows, or at least announced (so far)
- · Snapdragon 810 64-Bit Quad-core 1.5 GHz Cortex-A53 and Quad-core 2 GHz Cortex-A57
- · 3GB of internal RAM
- · 16GB/32GB ROM
- · Adreno 430 GPU
- · 5.2 Inch FHD (1920×1080) 420 Pixels Per Inch (PPI)
- · 13MP Primary Camera with 4K support
- · 8MP Secondary Camera
- · BenQ’s Variant of the Android 5.0 Lollipop Pre-installed
- · Micro SD card support
- · Beastly 4G LTE (CAT 9 support) 450mbps
And that’s it for the Pre-MWC updates so far in mid-february, be sure to check back to Androidfact.com for fresh articles and leaks to your hottest smartphones to be released.
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